Lenovo ThinkSystem SR675 V3 (8DW)

The Ultimate 3U GPU Flagship for AI Training & High-Performance Computing

The Lenovo ThinkSystem SR675 V3 (8DW) is a cutting-edge 3U rack server engineered for artificial intelligence (AI), high-performance computing (HPC), and large-scale GPU workloads. As the highest-density GPU variant in the SR675 V3 family, the 8DW model features a unique modular Gemini tray design that delivers unmatched compute density, thermal efficiency, and flexibility — supporting up to 8 double-wide PCIe 5.0 GPUs even in the most thermally demanding environments.

Key Highlights

• Maximum GPU Compute Density: Supports up to 8 double-wide PCIe 5.0 GPUs (e.g., NVIDIA H100 PCIe, L40S) within a 3U chassis, delivering extraordinary compute throughput.
• Innovative 8DW Thermal Design: Features a high-airflow Gemini tray optimized for 8 high-performance GPUs, with a full high-density hexagonal cooling mesh for superior front-to-rear airflow efficiency.
• 4th Gen AMD EPYC™ Processors: Supports dual 4th Gen AMD EPYC™ 9004 Series processors with up to 400W TDP, providing powerful CPU cores to feed GPU workloads.
• PCIe 5.0 & DDR5 Technology: Full adoption of PCIe Gen 5 and DDR5 memory doubles bandwidth and data transfer speeds compared to the previous generation.
• Optional Lenovo Neptune™ Liquid Cooling: Available on select configurations, Lenovo Neptune liquid cooling further reduces TCO and improves thermal efficiency for maximum performance.

Front Panel Overview

• 10 Vertically Numbered GPU Slots (1–10): The visual hallmark of the 8DW model. Numbers "10" to "1" are clearly displayed horizontally across the top bracket of the Gemini tray, corresponding directly to the 10 vertical GPU/cooling slots for easy multi-GPU management.
• High-Density Hexagonal Cooling Mesh: The entire front panel of the 8DW Gemini tray (excluding drive bays and mounting ears) features an ultra-dense hexagonal perforation pattern, maximizing airflow for all 8 double-wide GPUs.
• Symmetrical Drive Bay Layout (8x 2.5" Hot-Swap): Eight 2.5" hot-swap drive bays are arranged symmetrically (4 on each side) below the cooling mesh, supporting NVMe, SAS, or SATA drives.
• ThinkSystem SR675 V3 Branding: The right mounting ear clearly displays the "ThinkSystem SR675 V3" logo, with mechanical locking latch details for the Gemini tray visible in the design.

Internal Architecture

• Vertically Numbered Cooling Slots (1–10): The internal view reveals 10 vertical frames with fine hexagonal perforations inside the Gemini tray, each precisely corresponding to the numbered slots on the front panel.
• Optimized PCIe Gen 5 Cabling: Neatly routed green and blue cable bundles are visible behind the cooling frames — a direct CPU-connected cabling system optimized for PCIe Gen 5 high-bandwidth performance.
• 8x Double-Wide PCIe 5.0 GPU Configuration: The exploded view illustrates how the 10 slot spaces, combined with various riser card configurations, achieve the full 8DW GPU setup.
• Core Components & Redundant Power: Internal architecture includes 24x DDR5 DIMM slots, an OCP 3.0 slot, rear PCIe expansion slots, and up to 4 redundant Platinum/Titanium power supplies.

Technical Specifications

Summary

The Lenovo ThinkSystem SR675 V3 (8DW) combines precision industrial design — including vertically numbered cooling slots, organized cabling, and the iconic Gemini tray — with the power of 4th Gen AMD EPYC™ processors and PCIe 5.0 technology. It stands as the highest double-wide GPU density platform available in a 3U rack server, making it the definitive compute foundation for complex AI training, large-scale scientific simulation, and digital twin workloads.